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About The Department

Kuang-Hsi WU
Professor
University of Illinois at
Urbana-Champaign ‘ 84
Fall ‘84
wu@fiu.edu
(305) 348-3146

 

Degrees with Fields, Institutions and Date:

Ph.D., The University of Illinois at Champaign-Urbana, 1984
M.S, The University of Illinois at Champaign-Urbana, 1980
B.S, National Taiwan Inst. of Technology, Taiwan, 1975

Number of Years Service of this Faculty, Date of Original Appointments and Dates of Advancement in Rank:

18 Years

Professor, Mechanical Engineering Department, FIU, August 1995- Present
Acting Chairman, Mechanical Engineering Department, FIU, 1996                               
Associate Professor, Mechanical Engineering Department, FIU, 1990-1995
Assistant Professor, Mechanical Engineering Department, FIU, 1984-1990

Other Related Experience:

Oak Ridge Nat. Lab., Research Fellow, 1989-1991, 1997
Manufacturing Engineer, Taiwan, 1972-1985

Consulting, Patents, etc.:

Consultant, Kenyon & Kenyon Law Office, NY, 1997
Consultant, Cordis Corp., Miami, FL, 1985-1995
" Fiber-Reinforced Airplane Skin," inventors: Wu and Torres, Docket No:  29181/36280A (patent filed through FIU DSRT)

 State in which registered:  Florida

  Principal Publications (Last five years):

F. Yang, J. L. Ma, Z. J. Pu and K. H. Wu, Nanophase Crystallization of Amorphous Ribbon in NiTi-Cu Shape Memory Alloy, Phase Transformations and System Driven Far from Equilibrium, Material Research Society Symposium Proceedings, Vo. 481, 1998, p. 459-464.

Porter, G.A.; Liaw, P.K.; Tiegs, T.N.; Wu, K.H.,Particle size reduction of NiTi shape-memory alloy powders, Scripta Materialia, vol.43, no.12 p. 1111-17, December 2000.

Porter, G A ; Liaw, P K ; Tiegs, T N ; Wu, K H , Fatigue and fracture behavior of nickel-titanium shape- memory alloy reinforced aluminum composites<, Journal of Materials science & engineering. A. Structural materials: properties, microstructure and processing. 314, no. 1, (2001): 186 (8 pages).

Porter, G.A.; Liaw, P.K.; Tiegs, T.N.; Wu, K.H.,  Ni-Ti SMA-reinforced Al composites, Journal of Materials,  vol.52, no.10 p. 52-6, October 2000.

J. D. Shi, Z. J. Pu, K. H. Wu,  and G. Larkins,  Composite Materials with Adjustable Thermal Expansion Coefficient for Electronic Packaging Applications, Electronic Packaging Materials Science, Materials Research Society Sym. Proc., Dec., 1996,  Boston, MA.

F. Yang, K. Wu, and G. Larkins, The Characterization of Thermal Cycling Behavior of Si/YSZ/YBCO High-Temperature Superconductor Thin Films, Proceedings of ASC Conference 2000.

J. D. Shi,  J.L.Ma, Y.Gao, and Z.Pu, Times">Fabrication of Fine Grain Size SMA  through Crystallization of Amorphous Ribbon, Metastable Phase & Microstructures, Materials Research Society Sym. Proc., 1996, V400, p221.

J. Ma and K. Wu, CNT-Foam Ultra Light-Weignt Composites, SMEC Conference, March 2001, Miami, FL.

J. Ma and K. Wu, Constitutional phases and transformation characteristics of Ni44Ti39Ta20 alloy, Materials Science Forum, v 327, 2000, p155 - 158.

Membership in Scientific and Professional Societies:

American Society of Mechanical Engineers
Materials Research Society

Honors and Awards:                         

FIU Teaching Incentive Program Award, 1994
FIU Outstanding Research Award, 1993                                             
FIU Outstanding Teaching Award, 1991                                  
FIU Outstanding Achievement Award, 1990

Institutional and Professional Services (Last five years):

Int. Advisory Board, Int. J of Iron & Steel Research, and China., 1994-Present
Int. Advisory Board, 2000 Int. Sym. on Materials Science and Tech, China, 2000       
Int. Advisory Committee, Int. Sym on Shape Memory Alloys, Japan. 1999
Chairman, College Tenure and Promotion Committee, FIU, 1998
Chairman, College of Engineering and Design Curriculum Committee, FIU, 1990
Member, Florida International University Undergraduate Council, 1993

Professional Development Activities (Last five years):  Same as above

 
 
Engineering Accreditation Commission of the Accreditation Board for Engineering and Technology

The Engineering Accreditation Commission of the Accreditation Board for Engineering and Technology (EAC/ABET) accredits engineering programs on a nationwide basis. Students wishing more information about accreditation should consult their respective departmental office or the Office of the Dean. The following baccalaureate engineering programs in the college are accredited by ABET, Inc., Biomedical Engineering, Civil Engineering, Computer Engineering, Electrical Engineering, Industrial Engineering and Mechanical Engineering.

 
 

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