Degrees with
Fields, Institution, and Date:
Ph.D. Materials Science, Massachusetts
Institute of Technology, 1972
M.S. Metallurgy,
Florida State University, 1968
B.S. Engineering Science, Florida State
University, 1967
Number of Years Service of this Faculty,
Date of Original Appointment and Dates of
Advancement in Rank:
17 Years
Associate Dean, College of Engineering,
1994-1997
Professor, Florida International
University, 1992-Present
Associate Professor/Director
Biomedical Research, FIU 1986
Associate Professor/Chairman,
Florida International University, 1985-1986
Other Related Experience:
Cordis Corporation, Miami, Florida, Manager,
Pacer Engineering (80 professionals), various
other positions (1977-1985)
C.S. Draper Laboratory (formerly MIT Instrumentation
Lab), Cambridge, Mass. Group Head, Materials
Engineering (1972-1977)
Consulting, Patents, etc.:
4 US patents
CPS Corporation, Miami, FL
Heraeus Corporation,
Conshohocken, PA
Harris Corporation, Melbourne,
FL
Medical Research Group, Silmar, CA
State in which registered: N/A
Principal Publications (Last five years):
Wang, P., Jones, W.K., and Liu, Y., Thick
Silver Tape in Low Temperature Cofire Ceramic
(LTCC) for Thermal Management, Proc. 2001
International Microelectronics Conference,
IMAPS, Baltimore, MD, 2001.
Jones, W.K., Wang,P., and Liu, Y., Thermal
Management in LTCC Technology, Proc. INTERPACK,
ASME, Kauai, HI, 2001.
W. K. Jones, Y. Liu, P. Wang, and M. Zampino,
Chemical, Structural and Mechanical Properties
of LTCC Tapes, Int. J. Microcircuits and
Electronic Packaging, Vol. 23,, No. 4, 2000.
Barnwell, P., Free,C., Jones,W.K, and MacDonald,N.,
High Frequency Performance of LTCC Materials,
Proc. 2000 International Microelectronics
Conference, IMAPS, Boston, 2000.
Zampino, M.A., Jones, W.K., and Cao, Y.,
Substrate Embedded Heat Pipes Compatible
With Ceramic Cofire Processing, Int. J.
Microcircuits and Electronic Packaging,
Vol. 21, No. 1, pp. 52-58, 1998.
Jones, W.K.,Liu,Y.,Shah,M.,and Clarke,R.,
Mechanical Properties of Sb/Sn, Pb/In ands
Sn/In Solders, Soldering and Surface Mount
Technology, Vol.10,No.1, pps. 37-41, 1998.
Jones,W.K., Liu,Y., Zampino,M., and Gonzalez,G,
The At-Temperature Mechanical Properties
of Lead-Tin Based Solders from –200 °C
to 150 °C, Journal of Microcircuits
and Electronic Packaging, Vol. 20,2, 1997.
Schardt, C. and Jones, W.K., Cofired A1N
Pad Grid MCM-C/D for High Speed Digital
Applications, International Journal of Microcircuits
and Electronic Packaging, 15 (3), pp. 272-279.
Scientific and professional societies of
which a member:
IMAPS, ASME, IEEE
Honors and Awards:
Daniel C. Hughes Award, International Microelectronics
and Packaging Society (IMAPS). (1996)
Wagnon Technical Achievement Award, IMAPS,
awarded for the development of advanced
microelectronic packaging concepts 1999
1992 Fellow of the International Society
of Hybrid Microelectronics.
2001, 1991 Faculty Award for Excellence
in Research, Florida International University,
Honorary Degree and Awards Committee of
the Faculty Senate.
2002, Teaching Incentive Program (TIP)
award for excellence in teaching
1990 Achievement Award, FIU, in recognition
of the pursuit of excellence.
Who’s Who in America, Marquis, 2000,
2002
Who’s Who in the World, Marquis,
1999, 2001
Institutional and Professional Services
(Last five years):
Florida Manufacturing Extension Partnership,
a NIST MEP Network Affiliate, State Board
of Directors- South Florida Manufacturing
Technology Center, Board of Directors (1996-1999),
Board of Advisors (1999).
Trustee, IMAPS Educational Foundation,
1995- present
Technical Co-Chair, 1st, 2nd ,and 3rd International
Conference on Electronic Packaging, Peoples
Republic of China (1994,1996,1998).
Organizing Committee: NATO Advanced Research
Workshop (ARW) on Microelectronic Interconnections
and Microassembly, Prague, Czech Republic,
1996, 1st International Conference on electronic
Packaging, India,(1997), 1st Microelectronics
Conference, Israel, 1998.
Professional Development Activities (Last
five years):
ATMI (1998 - 2000), Sterling semiconductor,
Inc. (1998-2000). |
